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first level inc. is a technology-based contract assembly facility in York, Pennsylvania, specializing in first level microelectronics packaging. Since 2000 it has produced and assembled products for industries including medical electronics, optoelectronics, automotive sensors, military and aerospace, microwave and RF, and hybrid and multi-chip modules. It operates Class 10,000 ESD-protected cleanrooms and provides design, process, and manufacturing services from prototype to production.

Location: YORK, PA, USFounded: 2000Capabilities: 13Materials: 7Facilities: 1

Products & services offered

Classifications
Materials (7)
aluminum, ceramic, epoxy, gold, kovar, silver, solder

Facilities

Headquarters

3109 ESPRESSO WAY, YORK, PA 17406-6040, US

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