die attach

Pro-Active Engineering is an engineering-led electronics manufacturing services (EMS) provider building high-reliability PCB assemblies, box builds and full lifecycle program support for aerospace, defense, medical, industrial and critical power programs. Its Burnsville, MN facility operates as Analog Technologies, a Pro-Active Engineering company, providing advanced packaging, box build and full test capability since 1993.

AOIbox buildcable and harness assemblychassis and enclosure assemblyfirmware loadingflip-chip assemblyflying probe testingfunctional testingPCB assemblyPCB designsilver sinteringSMT assemblythrough-hole assemblywire bondingX-ray inspection

Azimuth Industrial Company Inc. was founded in 1972 and operates from a 20,000 sq ft manufacturing facility in Union City, California, serving U.S., Canadian and European customers. It specializes in plastic semiconductor packaging and ceramic packaging, assisting customers with new product evaluation, package design and development, and material selection and qualification. The company is ISO9001:2015 certified by TUV Rheinland Registrars and ITAR registered with the US Department of State.

ball bondingcompression moldingencapsulationflip chip bondingprototypingSMD placementsolder electro-platingtransfer moldingwafer sawing

Dallas Quantum Devices is a self-funded boutique photonics company founded in October 2018 by Jim Tatum, Luke Graham, and Pritha Khurana. It focuses on providing unique laser and detector solutions, specializing in highly customized VCSEL and photodiode solutions, and has developed VCSEL epitaxial structures ranging from 650nm to more than 1000nm fabricated into single mode, high power, and high speed devices.

automated optical inspectionflip chip mountingnear and far field measurementsphotonic design softwaresmall signal analysis to 40GHzthermo-compression bondingVCSEL designwafer level testingwafer qualification testingwire bonding

first level inc. is a technology-based contract assembly facility in York, Pennsylvania, specializing in first level microelectronics packaging. Since 2000 it has produced and assembled products for industries including medical electronics, optoelectronics, automotive sensors, military and aerospace, microwave and RF, and hybrid and multi-chip modules. It operates Class 10,000 ESD-protected cleanrooms and provides design, process, and manufacturing services from prototype to production.

BGA dicingdesign validationencapsulationfailure analysisflip chiphermetic lid sealingribbon bondingstud bumpingtestingtooling design and fabricationunderfillwire bonding