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777 Sourcing.

Capability

wafer bumping

Suppliers
2
States & provinces
2
Countries
1

2 wafer bumping suppliers across 2 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

AMKOR TECHNOLOGY ARIZONA, INC

TEMPE, AZ

Amkor Technology, Inc., headquartered in Tempe, Arizona, is a global leader in the Outsourced Semiconductor Assembly and Test (OSAT) industry. The company provides semiconductor packaging and test services, with more than 30,000 employees at 20 manufacturing locations in 11 countries. Amkor started its first semiconductor business in Korea in 1968 and was listed on NASDAQ (AMKR) in 1998.

2.5D/3D TSVburn-in testingflip chipsemiconductor packagingsemiconductor testSystem-in-Package (SiP)system level testwafer level packaging

Compiled from public sources

COLLIER VENTURES INC

RICHARDSON, TX

CVI (CVInc) is a semiconductor packaging and engineering company located in Richardson, TX, USA, incorporated in June 2001. It provides quick turn, high quality service, reliable products and engineering solutions, striving to improve packaging by increasing density and reducing cost. The company is ITAR compliant and supports small custom and prototype builds with all work completed in the US.

die bumpingENIG pillarsovermolded QFN packagingRDL

Compiled from public sources

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