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777 Sourcing.

Capability

System-in-Package (SiP)

Suppliers
2
States & provinces
2
Countries
1

2 system-in-package (sip) suppliers across 2 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

AMKOR TECHNOLOGY ARIZONA, INC

TEMPE, AZ

Amkor Technology, Inc., headquartered in Tempe, Arizona, is a global leader in the Outsourced Semiconductor Assembly and Test (OSAT) industry. The company provides semiconductor packaging and test services, with more than 30,000 employees at 20 manufacturing locations in 11 countries. Amkor started its first semiconductor business in Korea in 1968 and was listed on NASDAQ (AMKR) in 1998.

2.5D/3D TSVburn-in testingflip chipsemiconductor packagingsemiconductor testsystem level testwafer bumpingwafer level packaging

Compiled from public sources

BIWIN TECHNOLOGY LLC

DORAL, FL

BIWIN Storage Technology Co., Ltd. produces high-quality flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms. It has complete packaging, testing, and production lines, and recently opened a 110,000 m² facility, Greater Bay Advanced Technology Co., Ltd., with R&D and production.

16-Layer Die Stacking25 μm Wafer ProcessingCard PackageEnvironmental testingFailure Analysis (FA)firmware developmentFlip-Chip Ball Grid Array (FC-BGA)Flip Chip-Chip Scale Package (FCCSP)Land Grid Array (LGA)Multi-Chip & SiP Packagingpackaging and testingReliability TestingStorage Algorithms DevelopmentWire Bonding Ball Grid Array (WB-BGA)

Compiled from public sources

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