semiconductor packaging

Amkor Technology, Inc., headquartered in Tempe, Arizona, is a global leader in the Outsourced Semiconductor Assembly and Test (OSAT) industry. The company provides semiconductor packaging and test services, with more than 30,000 employees at 20 manufacturing locations in 11 countries. Amkor started its first semiconductor business in Korea in 1968 and was listed on NASDAQ (AMKR) in 1998.

2.5D/3D TSVburn-in testingflip chipsemiconductor testSystem-in-Package (SiP)system level testwafer bumpingwafer level packaging

BIOTRONIK is a medical technology company headquartered in Berlin that develops active implants and therapies for heart disease and chronic pain. Founded on Germany's first pacemaker in 1963, it operates globally across more than 100 countries, with products developed and produced in Germany, the US, and Singapore. Its business areas include Cardiac Rhythm Management, Electrophysiology, Neuromodulation, and Micro Systems Technologies.

cardiac rhythm managementelectrophysiologyNeuromodulationremote patient monitoringresearch and developmentsubstrate assembly

Boston Materials, Inc. develops advanced energy transfer materials and high-performance thermal interfaces for AI and HPC semiconductors, addressing thermal-mechanical challenges of multi-kilowatt-scale devices with large die arrays and complex warpage. The company operates ISO 9001 certified facilities in Massachusetts, USA with HVM-ready process technologies, QMS, and clean room facilities, and has a global supply chain partnership with Mitsubishi Chemical.

clean room operationshigh volume manufacturing (HVM)ISO 9001 certified operationsthermal management

BTU International is a global supplier of advanced thermal processing equipment for the electronics manufacturing market. It manufactures and sells reflow ovens and custom continuous belt furnaces used in solder reflow for SMT printed circuit board assembly and advanced semiconductor packaging, including AI chips. The company has over 70 years of thermal processing expertise, has shipped over 10,000 units, and provides service and support in over 30 countries.

24/7 customer serviceapplications labsatmosphere controlbelt furnace processingclosed-loop convection controldirect bond copperfurnace brazingMES integrationsintered metalssolder reflowthermal processingthick film processingtraining classes

Filtronic develops advanced RF and mmWave subsystems for space, defence and terrestrial communications, from design and manufacture through to test. With over 50 years of RF innovation, it engineers high-frequency technologies for satellite payloads, ground stations, radar, electronic warfare and next-generation telecoms, supported by vertically integrated manufacturing and product assurance.

automated die attachautomated production testdesign for manufactureenvironmental screeninghermetic sealinghybrid microelectronics manufacturingmicrowave and mmWave packagingprecision wire and ribbon bondingprocess engineeringRF & microwave testingRF package optimisation