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Capability

micro BGA

Suppliers
3
States & provinces
2
Countries
1

3 micro bga suppliers across 2 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

A and M Electronics, Inc. is a contract manufacturing facility serving the military, commercial and medical electronics industry since 1977. Located in Valencia, CA, it specializes in circuit board assembly (SMT and through hole), cabling, harnessing, box build and other electronic products. The company holds certifications including ISO 9001:2015, AS9100D, NADCAP, ITAR, and IPC/ANSI J-STD-001.

automatic optical inspectionBGABox buildburn-in testingcable assemblyConformal coatingde-ionized aqueous cleaningengineering and designhand solderingSMT assemblythrough-hole assemblywire harnessingX-ray inspection

BEMA Electronics is a US-based advanced electronics manufacturer with over two decades of manufacturing experience, specializing in complex, low-volume PCB assembly with full systems integration and sophisticated surface mount technology. Services cover prototype to production, from low to high volume. The company is ISO 9001:2015, AS9100:D, ISO 13485:2016, ITAR registered, and IPC610A Class II & III certified.

automated depanelizingautomated press fitcomponent traceabilityConformal coatingDFMDI water wash and ionic testingencapsulation/dispensingfine pitch SMTFunctional Testingin-circuit testingrapid prototypingreverse-engineeringRF testingsurface mount technologySystems integrationtest fixture developmentwave and selective soldering

First Electronics, Inc. is an ISO 9001 certified electronic contract manufacturing company based in Chandler, Arizona. It provides surface mount and thru-hole printed circuit board (PCB) assembly, supporting large volume production runs to engineering prototypes, along with fully integrated services including cables, electro mechanical assemblies, and full box-build chassis integration.

BGA placementbox-build chassis integrationcable and wire harness assemblyelectro-mechanical assemblyengineering changesfine pitch placementlarge-volume productionprototypesQFNsmall to medium size runssurface mount technologythru-hole assembly

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