flip chip bonding

Advafab is an innovative semiconductor solutions provider delivering customer-specific products and services for demanding industries and applications. It offers semiconductor pixel sensor modules and diodes and 1D sensors, along with a comprehensive suite of semiconductor services from design to production, serving industry and academy.

clean room processingdicingelectrical measurementmask designsensor manufacturingthin film processingunder-bump metallizationwafer solder bumpingwire bondingX-ray probing

AmTECH Microelectronics is a custom microelectronics assembly and packaging services company based in Silicon Valley (Morgan Hill, CA), with over 30 years of experience in process development, design for manufacturing (DFM), and on-shore prototype to production. Its facility features a fully equipped cleanroom with automated equipment, and it is ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, IPC-A-610 compliant, and follows MIL-STD-883 workmanship standards.

3D AOIDFMdie bonding/die attachencapsulationmetrology and inspectionprocess developmentsilver sinteringSMT assemblyvacuum reflowwire bonding

ASMPT is a global supplier of hardware, software and service solutions for semiconductor and electronics manufacturing. Founded in 1975, it offers integrated solutions covering all major steps in electronics manufacturing, from chip interconnection to chip assembly and packaging to SMT. It operates two main segments, Semiconductor (SEMI) Solutions and SMT Solutions, plus software subsidiary Critical Manufacturing.

advanced packagingchiplet integrationdie bondinglaser dicingline integration automationmanufacturing execution systemsmoldingsinteringSMT placementstencil printingthermo-compression bondingwire ball bonding

Azimuth Industrial Company Inc. was founded in 1972 and operates from a 20,000 sq ft manufacturing facility in Union City, California, serving U.S., Canadian and European customers. It specializes in plastic semiconductor packaging and ceramic packaging, assisting customers with new product evaluation, package design and development, and material selection and qualification. The company is ISO9001:2015 certified by TUV Rheinland Registrars and ITAR registered with the US Department of State.

ball bondingcompression moldingdie attachencapsulationprototypingSMD placementsolder electro-platingtransfer moldingwafer sawing