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Capability

depth profiling

Suppliers
3
States & provinces
3
Countries
1

3 depth profiling suppliers across 3 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

APPLIED SPECTRA INC

WEST SACRAMENTO, CA

Applied Spectra develops laser-based elemental and isotopic analysis instruments, including LIBS, laser ablation (LA-ICP-MS), and Tandem LA-LIBS platforms, along with the LuxION Chemical Intelligence Platform and ClarityNeXt software. Founded in 2004 by Dr. Richard E. Russo, the company serves researchers and manufacturers in battery materials, geoscience, nuclear energy, semiconductor, critical materials, and analytical research applications.

chemical imagingdata analysis softwareLA-ICP-MSlaser ablationLIBSmass spectrometryoptical emission spectroscopy

CAMECA INSTRUMENTS, INC

FITCHBURG, WI

CAMECA is a world leading supplier of microanalytical and metrology instrumentation for research and process control. Its instruments measure elemental and isotopic composition in materials down to atomic resolution and equip government and university labs as well as high-tech industrial companies worldwide. CAMECA is a business unit of AMETEK, Inc.

Atom Probe TomographyElectron Cyclotron Resonance ion sourcesElectron Probe Microanalysision beam sputter depositionion implantationisotopic analysisnanoscale 3D imagingsecondary ion mass spectrometry

ION-TOF USA INC

SPRING VALLEY, NY

IONTOF USA is the US-based subsidiary of IONTOF, a German manufacturer of instruments for surface analysis with product lines for time-of-flight secondary ion mass spectrometry (TOF-SIMS) and high-sensitivity low-energy ion scattering (LEIS). IONTOF was founded in 1989 as a spin-off of the University of Münster. IONTOF USA was founded in 2000 to represent IONTOF and its product lines in the United States and provide support to TOF-SIMS and LEIS customers, operating a full service network with trained service engineers across the United States.

3D analysisin situ SPMion beam technologylow energy ion scattering (LEIS)MS/MSretrospective analysissurface analysissurface imagingtime-of-flight secondary ion mass spectrometry (TOF-SIMS)

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