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HEXAspec specializes in manufacturing high-performance packaging fillers for next-generation chip packaging. Its innovative inorganic fillers provide 20 times higher thermal conductivity and enhanced protection, improving cooling efficiency and reducing operational surface temperatures. The company leverages existing industry techniques through the integration of additive manufacturing, ensuring precise quality control and offering customizable shapes to meet diverse needs.

LocationHOUSTON, TX, USFounded2024Capabilities4Materials1Facilities1

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Materials (1)
inorganic fillers

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7600 KIRBY DR APT 539, HOUSTON, TX 77030-4469, US

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Founded
2024

Source: company website

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