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Capability

wafer dicing

Suppliers
1
States & provinces
1
Countries
1

1 wafer dicing supplier across 1 states and provinces in 1 country. Profiles show capabilities, materials, certifications, and facility locations so you can compare shops and build a shortlist.

Suppliers

CENTERLINE TECHNOLOGIES, LLC

HUDSON, MA

Centerline Technologies provides ultra-precision surface finishing services including grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials for the telecommunication, semiconductor, communication, test & measurement, micro-electronic, defense and security industries. The company operates 14,250 sq ft of manufacturing and lab space in Hudson, Massachusetts, and also stocks and sells high quality materials purchased directly from major manufacturers.

chemical mechanical polishing (CMP)diamond sawinggrindinglappinglaser cuttinglaser drillinglaser machininglaser scribingpolishing

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