SLA-printable resin development

EnduraCure designs photocurable, degradable-by-design low-dielectric resins and films for use as electronic substrates and encapsulants. The materials perform during device use and break down at end of life through low-temperature hydrometallurgical methods, freeing components and precious metals for recovery. Born out of a University of Utah Materials Science lab in 2023, the company was awarded an NSF STTR Phase I grant in Fall 2025 and is working to bring its first materials to market.

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custom developmentlow-temperature hydrometallurgylow-temperature methanolysis degradationphotocurable resin formulation