datacenter design/automation

DGClaim Inc is a thermal analysis/management tech company based in Portland, Oregon. The team has years of experience in semiconductor manufacturing, especially thermal/stress analysis within packages and data centers. DGClaim provides thermomechanical analysis and datacenter design/automation tools to root-cause analyze and resolve cracking, delamination, and warpage problems in semiconductor package assembly, 3D printing, and data centers.

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3D printing analysisfracture analysisnumerical methods analysisthermal simulationsthermomechanical analysiswarping analysis