atomic layer deposition

Angstrom Engineering Inc. designs, engineers, manufactures and supports thin film deposition systems and provides coating services. The company states it has been empowering scientists since 1992 and describes itself as a global leader in engineering, manufacturing and support, with systems designed and assembled on-site by its engineers, technologists and scientists.

DC sputteringHiPIMSIon-assisted depositionion beam processingmagnetron sputteringpulsed DC sputteringpulsed laser depositionRF sputteringthermal evaporation

Arradiance designs and manufactures atomic layer deposition (ALD) and molecular layer deposition (MLD) systems for university and corporate R&D labs, including the GEMStar XT and PRIME product families. The company also runs an ALD and MLD coating foundry in Littleton, Massachusetts, offering rapid-turn coating services. Founded in 2003 with a DARPA contract to develop electron field-emission arrays using microchannel technology, Arradiance has acquired Lotus Applied Technology.

coating servicesellipsometrymolecular layer depositionplasma-enhanced ALDroll-to-roll ALDspatial ALDthermal ALD

ASM is a materials discovery company focused on enabling semiconductor innovation through materials purpose, engineering, and scale. It empowers leading semiconductor manufacturers with advanced wafer processing equipment, using thin-film deposition to shape materials for AI, healthcare, cloud computing, and energy-efficient devices. Founded in the Netherlands in 1968, ASM has 4800+ employees across 15 key locations and 58 years of research and breakthrough technologies.

CMPdiffusionepitaxyLPCVDMaterials engineeringoxidationPECVDR&Dsurface modificationsurface prepthin-film deposition

Calabazas Creek Research, Inc. (CCR) was established in 1994 and is a leader in development of advanced technologies for high power RF generation and transmission. CCR specializes in very high power microwave and millimeter-wave sources and components for research in high energy physics, fusion energy development, and advanced Department of Defense systems, with expertise from 1 GHz to 1 THz.

additive manufacturing / 3D printingbakeoutbraze, electron beam, laser beam, tungsten arc, and diffusion bonded jointsCAD designcathode activationceramic bondingchemical vapor depositiondynamic beam-RF PICelectromagnetic analysishigh voltage and electron beam processinghi-pottinghot wire sputteringprecision assemblythermomechanical analysis