BOISE, ID, US

AMERICAN SEMICONDUCTOR, INC

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Location: BOISE, ID, USFounded: 2001Capabilities: 8Materials: 2Facilities: 1

Products & services offered

Capabilities 8

200mm and 300mm processing pilot line
advanced substrates
assembly and test
chip-on-flex assembly
CMOS fabrication
design and prototyping

View all 8

IC design
wafer level chip scale packaging

Materials 2

Nobleflex
Ultraflex

Classifications

Materials (2): Nobleflex, Ultraflex

Facilities

Headquarters

6987 W TARGEE ST, BOISE, ID 83709, US

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Quantities, certifications, and timing.